|Minimum Order Quantity||1 Unit|
|Max Marking Speed||7000 mm/s|
|Laser Weav Length||1064 mm|
|Marking Depth||0.01-0.3 mm|
|Positioning Accuracy||0.01 mm|
|Cooling System||Air Cooling|
|Support Format||BMP, TIF, TAG, CDR, DXF, HPG|
|Processing Size LXW||8 feet 4 feet mm|
Being a well-renowned entity, we are engaged in providing a distinguished range of Laser Die Board Cutting Machine.
Applied in electronic components, telecommuication, machinery processing and producing , aeropace , packaging , crafts and other idustries. Applicable to marking on surface of almost all metal and part of nonmetal materials.